![](https://www.crea3d.com/5652-large_default/raise3d-df2-basic-package.jpg)
![](https://www.crea3d.com/5652-large_default/raise3d-df2-basic-package.jpg)
The Raise3D DF2 solution is a Digital Light Printing (DLP) printing system that provides fast printing speeds, smooth surfaces, high precision, and exceptional reliability. It is designed for engineering prototyping, manufacturing aids, and low-volume production using a wide variety of high-performance resins. Discover the efficient workflow via RFID as we redefine the possibilities of resin 3D printing.
Raise3D High Performance Engineering Resins: Meet demands for customized small batch production of precise prototyping and industrial engineering parts.
ORP (Open Resin Program):The aim of the ORP is to open to third-party resin manufacturers to develop high-performance resins, including co-branding with BASF and Henkel, to provide customers with a wider range of resin options.
Easy-to-print resin for prototyping and design
High-resolution material for detailed models
Tough and durable resin for functional applications
Material with high strength, rigidity and heat-resistance
Raise3D has partnered with third-party resin manufacturers such as BASF and Henkel to develop co-branded resins. This collaborative effort makes these resins an ideal choice for applications ranging from prototyping to intricate engineering projects.
XY Pixel: 78.5 μm
XY Resolution: 2560 x 1440 (2K)
From intricate model designs to complex engineering prototypes, Raise3D DF2 adopts top performing optical components, so that every detail is captured with the utmost accuracy.
Bigger, Faster, Better
200 x 112 x 300 mm
Max. up to 12 kg
From large-scale prototypes to intricate models, Raise3D DF2 printer makes it easy.
The Raise3D DF2 adapts effortlessly to the scale of production and maintains consistent quality.
RFID automatically stores and reads the relevant parameters of an entire workflow for printing, washing and curing, and is easy to mount and unmount, reducing the need for tedious manual operations.
Maximum load capacity of 200 kg for Z-axis. Features no staggered layers and high movement accuracy, ensuring the stability of printing large parts and extended use.
Air peel design between the resin vat bottom and the highly clear glass reduces the force from 50 kilograms to 10 kilograms, effectively peeling each layer and ensuring successful printing.
High-quality optical components are used throughout the entire optical path projection system to reduce loss, eliminate dispersion, ensuring the reproduction of sharp layers.
ideaMaker has added multiple new features that are compatible with Raise3D DF2 printer, reducing learning curves and improving the success rate of DLP printing.
Print Technology: DLP
Build Size (W×D×H): 200 x 112 x 300 mm
Machine Size (W×D×H): 450 x 400 x 730 mm
XY Pixel Size: 78.5 micron
XY Resolution: 2560 x 1440
Max Z Workload: 12 kg
Max Printing Speed: 25 mm/h (0.1 mm per layer)
Layer Height: 50-100 micron
Resin Level Detection: Yes
Auto Resin Refill: Yes
Control Panel: Touch Screen (1920 x 720, Magic Layout)
RFID Print Platform: Yes
Level Calibration: Calibrated in Factory
Chamber Heating: Yes (Max. 40℃)
HARDWARE | Print Technology | DLP |
Build Volume (W × D × H) | 200 × 112 × 300 mm | |
XY Pixel Size | 78.5 micron | |
XY Resolution | 2560 × 1440 | |
Max Z Workload | 12 kg | |
Layer Height | 50-100 micron | |
Max Printing Speed | 25 mm/h (0.1 mm per layer) | |
Resin Level Detection | Yes | |
Auto Resin Refill | Yes | |
Control Panel | Touch Screen (1920 × 720, Magic Layout) | |
Level Calibration | Calibrated in Factory | |
Chamber Heating | Yes (Max 40℃) | |
RESINS | Raise3D Standard | White |
Raise3D High Detail | Apricot | |
Raise3D Tough 2K | Grey | |
Raise3D Rigid 3K | Grey | |
Raise3D High Clear | Coming Soon | |
Raise3D High Temperature | Coming Soon | |
Open Resin Program | Coming Soon | |
SOFTWARE & NETWORKS | Connectivity | Wi-Fi, LAN, USB port × 2, Live camera |
Network | Ethernet, Wireless 802.11 b/g/n | |
Slicing Software | ideaMaker | |
Remote Management Software | RaiseCloud | |
Supported File Types | STL/ OBJ/ 3MF/ OLTP | |
Supported OS | WINDOWS/ macOS/ LINUX | |
OPERATION & SHIPPING | Power Supply Input | 100-240VAC, 50/60 Hz 230V @ 3.3A |
Operating Ambient Temperature | 15 - 30°C, 10 - 90% RH Non-Condensing (HOLD) | |
Storage Temperature | -25 to 55°C, 10 - 90% RH Non-Condensing (HOLD) | |
Machine Size (W × D × H) | 450 × 400 × 730 mm | |
Weight | 40 kg (Net Weight) 59.4 kg (Gross Weight) |
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Shipping Dimensions | 710 × 595 × 980 mm |
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