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PolyMide™ CoPA is a copolymer of Nylon 6 and Nylon 6,6 combining high tensile strength properties from Nylon 6 with heat resistance properties from Nylon 6.6. Warp-Free™ technology provides ease of printing by slowing down the crystallization allowing CoPA to be easily printed on open bed printers.
The shrinkage rate depends on the print model size and infill setting.
Do you need to anneal PolyMide™ CoPA?
PolyMide™ CoPA displays outstanding mechanical and thermal properties when fully crystallized. The printed part will not reach full crystallization after the printing process, an additional step is required: Annealing. You can anneal PolyMide™ CoPA by placing your part in the oven at 80_C for 6h.
Does PolyMide™ CoPA requires an enclosed printer?
No, all our Nylon features our Warp-Free Technology which means it does not require a heated bed or heated chamber of more than 50_C. PolyMide™ CoPA can be printed on a 30-40_C bed without enclosure.
The igus® 3D printing materials are especially advantageous in moving applications due to their abrasion resistance and durability with a tested service life.
PolyMax™ PC is an engineering PC filament combining excellent strength,toughness, heat resistance and printing quality. It outperforms many other choices of PC while still printing at a relatively low printing temperature. With a softening point of 113°C it can operate in demanding environments where impact resistance, heat resistance and vibrations occur.
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