Promozioni attive  Italiano  Filamenti KIMYA  |  Bambu Lab X1E Bundle  |  Scanner Shining3D  |  Stampanti 3D UltiMaker e Raise3D

Active Promotions  English  KIMYA Filaments  |  Bambu Lab X1E Bundle  |  Shining3D scanners  |  UltiMaker and Raise3D 3D printers

Promociones activas  Español  Filamentos KIMYA  |  Bambu Lab X1E Bundle  |  Escáneres Shining3D  |  Impresoras 3D UltiMaker y Raise3D

Promotions actives  Français  Filaments KIMYA  |  Bambu Lab X1E Bundle  |  Scanners Shining3D  |  Imprimantes 3D UltiMaker et Raise3D

Aktive Werbeaktionen  Deutsch  KIMYA-Filamente  |  Bambu Lab X1E Bundle  |  Shining3D-Handscanner  |  UltiMaker und Raise3D 3D-Drucker

Ultrafuse PA (Nylon) 750g

50.34 €
Tax excluded
Not Rated
paga in 3 rate con Klarna
pay in 3 with Klarna
paga en 3 plazos con Klarna
payez en 3 fois avec Klarna
Zahlen Sie in 3 Raten mit Klarna
prodotto presente su  Crea3D è presente su MEPA
Diameter

Volume discounts

QuantityPriceYou Save
447.82 €Up to 10.07 €
845.31 €Up to 40.27 €
1642.79 €Up to 120.82 €
In Stock

First Forward AM filament developed on Ultramid®

Ultrafuse® PA is specially developed for FFF printing based on Forward AM's polyamide portfolio known as Ultramid®. With its unique mechanical properties due to its chemical structure it is suitable for wide range applications working in broader temperature range.

Forward AM‘s Ultramid® grades are molding compounds on the basis of PA6, PA66 and various co-polyamides such as PA6/66. Ultramid® is noted for its high mechanical strength, stiffness and thermal stability. In addition, Ultramid® offers good toughness at low temperatures. Owing to its excellent properties, this material has become indispensable in almost all sectors of engineering for a wide range of different components and machine elements, as a high-grade electrical insulation material and for many special applications.

Ultrafuse® PA is the translation of Forward AM's Ultramid® to 3D printing space. It is based on copolyamide 6/66 grade of intermediate viscosity. With Ultrafuse® PA, it is possible to print semi-flexible thin parts, however it is very stiff in higher thicknesses. It has a lower melting temperature than PA6 and PA66 hence it can be printed in a lower temperature as well as it has better impact strength against PA6 and PA66 which opens up a new application field to the end-users. Depending on specific requirements, the formulation can be optimized further, and special fi laments can be created.

Advantages of Ultrafuse® PA

  • Good fatigue resistance
  • Low melting point makes it printable for many FFF printers
  • Good wear resistance/lubricity
PA-4501A075

Download


Ultrafuse PA (TDS)

Technical Data Sheet (EN)

Download (350.15k)
Nozzle temperature 220 – 250 °C
Bed temperature 90 - 120 °C
Nozzle diameter  0.4 mm
Bed modification Glass + PrintaStick / Kapton tape
Print speed 30 - 60 mm/s

Write your review

No customer reviews for the moment.

You might also like