Cierre de oficinas y depósitos del 24 de Diciembre al 6 de Enero. Los pedidos realizados en estas fechas se procesarán a partir del 7 de enero de 2025..
Schließung von Büro und Lagerhalle vom 24. Dezember bis 6. Januar. An diesen Terminen aufgegebene Bestellungen werden ab dem 7. Januar 2025 bearbeitet.
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The FUNMAT HT is fully capable of 3D printing high-performance functional materials like PEEK, ULTEM and PPSU, in addition to a broad range of engineering thermoplastics. Users can achieve 50-micron high resolution industrial quality 3D printing of the FUNMAT HT.
The FUNMAT PRO 410 is an industrial additive manufacturing 3D printer designed and manufactured by INTAMSYS. For the very first time, the INTAMSYS FUNMAT PRO 410 features a dual extruder which operate in a large 305 x 305 x 406 mm build chamber.
The FUNMAT PRO 610 HT is the latest addition to the INTAMSYS 3D printers FUNMAT serie. It is an industrial high-end machine designed for critical requirement functional part test & low volume production. The high build volume of 610x508x508mm enables you to print big size parts.
iOn™ Nylon 6 Alloy was created to bring practical functionality to the 3D Printing experience. iOn™ is an engineering grade material that can be used in demanding applications where PLA and ABS fail due to shortcomings in mechanical, thermal, or chemical performance.
INTAMSYS PC-ABS (polycarbonate/acrylonitrile-butadiene-styrene terpolymer blend) is a thermoplastic alloy, which is designed specifically for FFF 3D printing.
PEI 1010 is a high-performance thermoplastic – Polyetherimide (PEI), which offers excellent strength, thermal stability and the ability to withstand steam autoclaving.
Intamsys ABS is a ABS based filament designed specifically for desktop FDM/FFF 3D printing. It offers superior printing quality.excellent mechanical strength and heat resistance, with moderate printing temperatures and great warping resistance.
iOn™ Nylon 6 Alloy was created to bring practical functionality to the 3D Printing experience. iOn™ is an engineering grade material that can be used in demanding applications where PLA and ABS fail due to shortcomings in mechanical, thermal, or chemical performance.